research-article

E-BLOW: e-beam lithography overlapping aware stencil planning for MCC system

Authors:

David Z. PanAuthors Info & Claims

DAC '13: Proceedings of the 50th Annual Design Automation Conference

Article No.: 70, Pages 1 - 7

https://doi.org/10.1145/2463209.2488819

Published: 29 May 2013 Publication History

Abstract

Electron beam lithography (EBL) is a promising maskless solution for the technology beyond 14nm logic node. To overcome its throughput limitation, recently the traditional EBL system is extended into MCC system. In this paper, we present E-BLOW, a tool to solve the overlapping aware stencil planning (OSP) problems in MCC system. E-BLOW is integrated with several novel speedup techniques, i.e., successive relaxation, dynamic programming and KD-Tree based clustering, to achieve a good performance in terms of runtime and solution quality. Experimental results show that, compared with previous works, E-BLOW demonstrates better performance for both conventional EBL system and MCC system.

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Cited By

Li XLi JWu HChen Y(2021)Discrete relaxation method for hybrid e-beam and triple patterning lithography layout decompositionJournal of Ambient Intelligence and Humanized Computing10.1007/s12652-021-02939-xOnline publication date: 12-Feb-2021
https://doi.org/10.1007/s12652-021-02939-x
Li XZhu W(2017)Two-Stage Layout Decomposition for Hybrid E-Beam and Triple Patterning LithographyACM Transactions on Design Automation of Electronic Systems10.1145/308468323:1(1-23)Online publication date: 1-Aug-2017
https://dl.acm.org/doi/10.1145/3084683
Ge JYan CZhou HZhou DZeng X(2017)An efficient algorithm for stencil planning and optimization in E-beam lithography2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC)10.1109/ASPDAC.2017.7858350(366-371)Online publication date: Jan-2017
https://doi.org/10.1109/ASPDAC.2017.7858350
Show More Cited By

Index Terms

E-BLOW: e-beam lithography overlapping aware stencil planning for MCC system
1. Hardware
  1. Electronic design automation
    1. Physical design (EDA)

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cover image ACM Conferences

DAC '13: Proceedings of the 50th Annual Design Automation Conference

May 2013

1285 pages

ISBN:9781450320719

DOI:10.1145/2463209

Copyright © 2013 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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New York, NY, United States

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Published: 29 May 2013

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DAC '13: The 50th Annual Design Automation Conference 2013

May 29 - June 7, 2013

Texas, Austin

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

Li XLi JWu HChen Y(2021)Discrete relaxation method for hybrid e-beam and triple patterning lithography layout decompositionJournal of Ambient Intelligence and Humanized Computing10.1007/s12652-021-02939-xOnline publication date: 12-Feb-2021
https://doi.org/10.1007/s12652-021-02939-x
Li XZhu W(2017)Two-Stage Layout Decomposition for Hybrid E-Beam and Triple Patterning LithographyACM Transactions on Design Automation of Electronic Systems10.1145/308468323:1(1-23)Online publication date: 1-Aug-2017
https://dl.acm.org/doi/10.1145/3084683
Ge JYan CZhou HZhou DZeng X(2017)An efficient algorithm for stencil planning and optimization in E-beam lithography2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC)10.1109/ASPDAC.2017.7858350(366-371)Online publication date: Jan-2017
https://doi.org/10.1109/ASPDAC.2017.7858350
Yu BYuan KGao JHu SPan D(2016)EBL Overlapping Aware Stencil Planning for MCC SystemACM Transactions on Design Automation of Electronic Systems10.1145/288839421:3(1-24)Online publication date: 16-May-2016
https://dl.acm.org/doi/10.1145/2888394
Tian HWong M(2016)Performance evaluation considering mask misalignment in multiple patterning decomposition2016 17th International Symposium on Quality Electronic Design (ISQED)10.1109/ISQED.2016.7479199(192-197)Online publication date: Mar-2016
https://doi.org/10.1109/ISQED.2016.7479199
Kuang JYoung E(2016)Row-structure stencil planning approaches for E-beam lithography with overlapped charactersIntegration10.1016/j.vlsi.2016.07.00255(232-245)Online publication date: Sep-2016
https://doi.org/10.1016/j.vlsi.2016.07.002
Yu BPan DYu BPan D(2016)Design for Manufacturability with E-Beam LithographyDesign for Manufacturability with Advanced Lithography10.1007/978-3-319-20385-0_5(111-157)Online publication date: 2016
https://doi.org/10.1007/978-3-319-20385-0_5
Yu BPan DYu BPan D(2016)IntroductionDesign for Manufacturability with Advanced Lithography10.1007/978-3-319-20385-0_1(1-6)Online publication date: 2016
https://doi.org/10.1007/978-3-319-20385-0_1
Chu CMak W(2015)Flexible Packed Stencil Design With Multiple Shaping Apertures and Overlapping Shots for E-beam LithographyIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2015.242725634:10(1652-1663)Online publication date: Oct-2015
https://doi.org/10.1109/TCAD.2015.2427256
Daifeng Guo Yuelin Du Wong M(2015)Polynomial time optimal algorithm for stencil row planning in e-beam lithographyThe 20th Asia and South Pacific Design Automation Conference10.1109/ASPDAC.2015.7059083(658-664)Online publication date: Jan-2015
https://doi.org/10.1109/ASPDAC.2015.7059083
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