skip to main content
10.1145/2463209.2488855acmconferencesArticle/Chapter ViewAbstractPublication PagesdacConference Proceedingsconference-collections
research-article

Reliability challenges for electric vehicles: from devices to architecture and systems software

Published: 29 May 2013 Publication History

Abstract

Today, modern high-end cars have close to 100 electronic control units (ECUs) that are used to implement a variety of applications ranging from safety-critical control to driver assistance and comfort-related functionalities. The total sum of these applications is several million lines of software code. The ECUs are connected to different sensors and actuators and communicate via a variety of communication buses like CAN, FlexRay and now also Ethernet. In the case of electric vehicles, both the amount and the importance of such electronics and software are even higher. Here, a number of hydraulic or pneumatic controls are replaced by corresponding software-implemented controllers in order to reduce the overall weight of the car and hence to improve its driving range. Until recently, most of the software and system design in the automotive domain -- as in many other domains -- relied on an always correctly functioning or a zero-defect hardware implementation platform. However, as the device geometries of integrated circuits continue to shrink, this assumption is increasingly not true. Incorporating large safety margins in the design process results in very pessimistic design and expensive processors. Further, the processors in cars -- in contrast to those in many consumer electronics devices like mobile phones -- are exposed to harsh environments, extreme temperature variations, and often, strong electromagnetic fields. Hence, their reliability is even more questionable and must be explicitly accounted for in all layers of design abstraction -- starting from circuit design to architecture design, to software design and runtime management and monitoring. In this paper we outline some of these issues, currently followed practices, and the challenges that lie ahead of us in the automotive and electric vehicles domain.

References

[1]
E. Frickenstein. Mikroelektronik fährt BMW ConnectedDrive. In 3. Symposium Mikroelektronik, Berlin, Germany, September 25--25, 2012.
[2]
S. R. Nassif. Modeling and forecasting of manufacturing variation (embedded tutorial). In ASP-DAC, 2001.
[3]
D. Boning and S. R. Nassif. Models of process variations in device and interconnect. In Design of High-Performance Microprocessor Circuits, A. Chandrakasan, Ed. Piscataway, NJ: IEEE Press, 2000.
[4]
D. Blaauw, et al. Statistical timing analysis: from basic principles to state of the art. IEEE Transactions on CAD, 27 (4): 589--607, Apr. 2008.
[5]
K. Kuhn et al. Managing process variation in Intel's 45nm CMOS technology. In Intel Technology Journal, 12(2): 131--144, June 2008.
[6]
S. R. Nassif, N. Mehta, and Y. Cao. A resilience roadmap. In DATE, 2010.
[7]
S. R. Nassif, V. B. Kleeberger, and U. Schlichtmann. Goldilocks failures: not too soft, not too hard. In In Proc. of Reliability Physics Symposium, 2011.
[8]
K. Bernstein et al. High-performance CMOS variability in the 65-nm regime and beyond. In IBM Journal of Research and Development, 50(4.5): 433--449, 2006.
[9]
S. R. Nassif. Modeling and analysis of manufacturing variations. In CICC, 2001.
[10]
D. Lorenz, M. Barke, and U. Schlichtmann. Aging analysis at gate and macro cell level. In ICCAD, 2010.
[11]
K. N. Tu. Recent advances on electromigration in very-large-scale-integration of Interconnects. In. J. Appl. Phys, 94(9), September 2003.
[12]
N. Weste and D. Harris, CMOS VLSI Design: A Circuits and Systems Perspective, Addison-Wesley, 2009.
[13]
Synopsys PrimeTime Advanced OCV Technology
[14]
H. Graeb. Analog Design Centering and Sizing. Springer, 2007.
[15]
K.-C. Wu and D. Marculescu: Aging-aware timing analysis and optimization considering path sensitization. In DATE, 2011.
[16]
D. Lorenz, M. Barke, and U. Schlichtmann. Efficiently analyzing the impact of aging effects on large integrated circuits. In Microelectronics Reliability 52(8), 1546--1552, August 2012.
[17]
M. Alam, B. Weir, and P. Silverman. A study of soft and hard breakdown - Part II: Principles of area, thickness, and voltage scaling. In IEEE Transactions on Electron Devices,. 49(2): 239--246, February 2002.
[18]
R. Degraeve et al. Relation between breakdown mode and location in short-channel nMOSFETs and its impact on reliability specifications. In Proc. of Reliability Physics Symposium, 2001.
[19]
R. Rodriguez et al. The impact of gate oxide breakdown on SRAM stability. In IEEE Electron Device Letters, 23(2), September 2002.
[20]
B. Kaczer et al., Gate oxide breakdown in FET devices and circuits: from nanoscale physics to system-level reliability. In Microelectronics Reliability, 47(4-5), April-May 2007.
[21]
N. P. Carter, H. Naeimi, and D. S. Gardner. Design techniques for cross-layer resilience. In DATE, 2010.
[22]
Y.-H. Lee et al. Prediction of logic product failure due to thin-gate oxide breakdown. In Proc. of Reliability Physics Symposium, 2006.
[23]
M. A. Alam et al. Statistically independent soft breakdowns redefine oxide reliability specifications. In Proc. of Int. Elec. Dev. Meeting (IEDM), 2002.
[24]
H. Matsuyama et al.: Investigation of stress-induced voiding inside and under vias in copper interconnects with "wing" pattern. In Proc. of Reliability Physics Symposium, 2008.
[25]
J. Henkel et al. Design and architectures for dependable embedded systems. International Conference on Hardware/Software Co-design and System Synthesis (CODES+ISSS), 2011.
[26]
A. Herkersdorf et al. Cross-layer dependability modeling and abstraction in systems on chip. In Workshop on Silicon Errors in Logic - System Effects (SELSE), 2013.
[27]
V. B. Kleeberger et al. Program-aware circuit level timing analysis. In International Symposium on Integrated Circuits (ISIC), 2011.
[28]
M. Choudhury et al. Analytical model for TDDB-based performance degradation in combinational logic. In IEEE Design, Automation, and Test in Europe (DATE), 2010.
[29]
R. Hartl et al. Architectural vulnerability factor estimation with backwards analysis. In 13th Euromicro Conference on Digital System Design, 2010.
[30]
S. A. Seshia, W. Li, and S. Mitra. Verification-guided soft error resilience. In DATE 2007.
[31]
D. Ernst et al. RAZOR: A low-power pipeline based on circuit-level timing speculation. In Micro-36, 2003.
[32]
M. Wirnshofer et al. On-line supply voltage scaling based on in-situ delay monitoring to adapt for PVTA variations. In Journal of Circuits, Systems, and Computers, 21(8), 2012.
[33]
S. Mukerjee et al. Measuring architectural vulnerability factors. In IEEE Micro, 23(6): 70--75, 2003.
[34]
Rausch, M. FlexRay: Grundlagen, Funktionsweise, Anwendung. In Carl Hanser Verlag GmbH & CO. KG.
[35]
S. Rehman et al. Reliable software for unreliable hardware: Embedded code generation aiming at reliability. In CODES + ISSS, 2011.
[36]
U. D. Bordoloi et al. Reliability-aware instruction set customization for ASIPs with hardened logic. In RTCSA, 2012.
[37]
B. Tanasa et al. Reliability-aware frame packing for the static segment of FlexRay. In International Conference on Embedded Software (EMSOFT), 2011.
[38]
J. Suh, et al. Soft error benchmarking of L2 caches with PARMA. In SIGMETRICS, 39(1), 2011.
[39]
J. Suh, M. Annavaram, and M. Dubois. MACAU: A Markov model for reliability evaluations of caches under single-bit and multi-bit upsets. In HPCA, 2012.
[40]
P. Milbredt et al. Switched FlexRay increasing the effective bandwidth and safety of FlexRay networks. In 15th International Conference on Emerging Technology and Factory Automation (EFTA), 2010.

Cited By

View all
  • (2025)Controllers for Edge-Cloud Cyber-Physical Systems2025 17th International Conference on COMmunication Systems and NETworks (COMSNETS)10.1109/COMSNETS63942.2025.10885702(198-206)Online publication date: 6-Jan-2025
  • (2024)Introduction to the Special Issue on Automotive CPS Safety & Security: Part 2ACM Transactions on Cyber-Physical Systems10.1145/36502108:2(1-17)Online publication date: 8-Mar-2024
  • (2024)Wear Leveling-Aware Active Battery Cell Balancing2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)10.1109/VLSID60093.2024.00114(643-648)Online publication date: 6-Jan-2024
  • Show More Cited By

Recommendations

Comments

Information & Contributors

Information

Published In

cover image ACM Conferences
DAC '13: Proceedings of the 50th Annual Design Automation Conference
May 2013
1285 pages
ISBN:9781450320719
DOI:10.1145/2463209
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

Sponsors

In-Cooperation

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 29 May 2013

Permissions

Request permissions for this article.

Check for updates

Author Tags

  1. aging
  2. automotive electronics
  3. cross-layer
  4. electric vehicles
  5. embedded systems
  6. low power
  7. process variations
  8. software

Qualifiers

  • Research-article

Conference

DAC '13
Sponsor:

Acceptance Rates

Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

Upcoming Conference

DAC '25
62nd ACM/IEEE Design Automation Conference
June 22 - 26, 2025
San Francisco , CA , USA

Contributors

Other Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

  • Downloads (Last 12 months)36
  • Downloads (Last 6 weeks)1
Reflects downloads up to 02 Mar 2025

Other Metrics

Citations

Cited By

View all
  • (2025)Controllers for Edge-Cloud Cyber-Physical Systems2025 17th International Conference on COMmunication Systems and NETworks (COMSNETS)10.1109/COMSNETS63942.2025.10885702(198-206)Online publication date: 6-Jan-2025
  • (2024)Introduction to the Special Issue on Automotive CPS Safety & Security: Part 2ACM Transactions on Cyber-Physical Systems10.1145/36502108:2(1-17)Online publication date: 8-Mar-2024
  • (2024)Wear Leveling-Aware Active Battery Cell Balancing2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)10.1109/VLSID60093.2024.00114(643-648)Online publication date: 6-Jan-2024
  • (2024)SMT-based Control Safety Property Checking in Cyber-Physical Systems under Timing Uncertainties2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)10.1109/VLSID60093.2024.00052(276-280)Online publication date: 6-Jan-2024
  • (2024)Certifiable and Efficient Autonomous Cyber-Physical Systems Design2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)10.1109/VLSID60093.2024.00049(259-263)Online publication date: 6-Jan-2024
  • (2024)Learning-Enabled CPS for Edge-Cloud Computing2024 IEEE 14th International Symposium on Industrial Embedded Systems (SIES)10.1109/SIES62473.2024.10767956(132-139)Online publication date: 23-Oct-2024
  • (2024)Quantitative Safety-Driven Co-Synthesis of Cyber-Physical System Implementations2024 ACM/IEEE 15th International Conference on Cyber-Physical Systems (ICCPS)10.1109/ICCPS61052.2024.00016(99-110)Online publication date: 13-May-2024
  • (2024)GPU Partitioning & Neural Architecture Sizing for Safety-Driven Sensing in Autonomous Systems2024 International Conference on Assured Autonomy (ICAA)10.1109/ICAA64256.2024.00018(67-76)Online publication date: 10-Oct-2024
  • (2024)Special Session: Emerging Architecture Design, Control, and Security Challenges in Software Defined Vehicles2024 International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS)10.1109/CODES-ISSS60120.2024.00014(27-36)Online publication date: 29-Sep-2024
  • (2024)Towards sustainable automobile ecosystem in India: Integrated analysis of technical, economic, and ESG dimensionsCleaner Environmental Systems10.1016/j.cesys.2024.100210(100210)Online publication date: Jul-2024
  • Show More Cited By

View Options

Login options

View options

PDF

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

Figures

Tables

Media

Share

Share

Share this Publication link

Share on social media