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Relays do not leak: CMOS does

Published: 29 May 2013 Publication History

Abstract

This paper describes the micro-architectural and circuit design techniques for building complex VLSI circuits with micro-electromechanical (MEM) relays and presents experimental results to demonstrate the viability of this technology. By tailoring the circuits and micro-architecture to the relay device characteristics, the performance of the relay-based multiplier is improved by an order of magnitude over any known static CMOS style implementation, and by ~4x over CMOS pass-gate equivalent implementations. A 16-bit relay multiplier is shown to offer ~10x lower energy per operation at sub-10 MOPS throughputs when compared to an optimized CMOS multiplier at an equivalent 90 nm technology node. The functionality of the primary multiplier building block, a full (7:3) compressor built with 46 scaled MEM-relays, which is the largest working MEM-relay circuit reported to date, is also demonstrated.

References

[1]
Calhoun, B. H., Wang, A., and Chandrakasan, A. "Modeling and sizing for minimum energy operation in subthreshold circuits," IEEE J. Solid-State Circuits, vol. 40, no. 9, pp. 1778--1786, Sep. 2005.
[2]
Nathanael, R. Pott, V., Kam, H., Jeon, J., and Liu, T. J-. K. "4-terminal relay technology for complementary logic," in Proc. IEEE Int. Electron Device Meeting Tech. Dig., Dec. 2009, pp. 223--226.
[3]
Chen, F., Kam, H., Markovic, D., Liu, T.-J. K., Stojanovic, V. and Alon, E. "Integrated circuit design with NEM relays," in Proc. IEEE/ACM Int. Conf. Computer-Aided Design, Nov. 2008, pp. 750--757.
[4]
Chen, F. et al. "Demonstration of integrated micro-electromechanical switch circuits for VLSI applications," in Proc. IEEE Int. Solid-State Circuits Conf. Tech. Dig., Feb. 2010, pp. 150--151.
[5]
Fariborzi, H. et al. "Analysis and Demonstration of MEM-relay Power Gating," IEEE Custom Integrated Circuits Conf., 2010, San Jose, CA.
[6]
Spencer, M. et al. "Demonstration of Integrated Micro-electro-mechanical Relay Circuits for VLSI Applications," IEEE J. Solid-State Circuits, vol. 46, no. 1, pp. 308--320, Jan. 2011.
[7]
Fariborzi, H., Chen, F., Nathanael, R., Jeon, J., Liu, T. K. and Stojanovic, V. "Design and Demonstration of Micro-electromechanical Relay Multipliers," in Proc. IEEE Asian Solid State Circuit Conf., Jeju, S. Korea, 2011, pp. 117--120.
[8]
Chen, Y., Nathanael, R., Jeon, J., Yaung, J., Hutin, L., and Liu T.-J.K. "Characterization of Contact Resistance Stability in MEM-relays With Tungsten Electrodes", IEEE J. MEMS. vol. 21, no. 3, pp. 511--513, June 2012.
[9]
Hsu, S. K. et al. "A 110 GOPS/W 16-bit multiplier and reconfigurable PLA loop in 90-nm CMOS," IEEE J. Solid-State Circuits, vol. 41, no. 1, pp. 256--264, Jan. 2006.
[10]
Kam, H., Liu, T. K., Stojanovic, V., Markovic, D. and Alon, E. "Design, optimization, and scaling of MEM-relays for ultra-low-power digital logic," IEEE Trans. Electron Devices, vol. 58, no. 1, pp. 236--250, Jan. 2010.
[11]
Chen, I. R. et al. "Scaled Micro-Relay Structure with Low Strain Gradient for Reduced Operating Voltage," ECS Trans., vol 45, no. 6, pp 101--106, 2012.

Cited By

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  • (2022)Breakdown and Healing of Tungsten-Oxide Films on Microelectromechanical Relay ContactsJournal of Microelectromechanical Systems10.1109/JMEMS.2021.313525931:2(265-274)Online publication date: Apr-2022
  • (2021)DyTAN: Dynamic Ternary Content Addressable Memory Using Nanoelectromechanical RelaysIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2021.311562229:11(1981-1993)Online publication date: Nov-2021
  • (2021)Design and Demonstration of MEM Relay-Based Arithmetic and Sequential Circuit BlocksIEEE Transactions on Electron Devices10.1109/TED.2021.311866368:12(6415-6421)Online publication date: Dec-2021
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cover image ACM Conferences
DAC '13: Proceedings of the 50th Annual Design Automation Conference
May 2013
1285 pages
ISBN:9781450320719
DOI:10.1145/2463209
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 29 May 2013

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Author Tags

  1. MEM-relays
  2. energy-aware VLSI design
  3. ideal switches
  4. multipliers

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Cited By

View all
  • (2022)Breakdown and Healing of Tungsten-Oxide Films on Microelectromechanical Relay ContactsJournal of Microelectromechanical Systems10.1109/JMEMS.2021.313525931:2(265-274)Online publication date: Apr-2022
  • (2021)DyTAN: Dynamic Ternary Content Addressable Memory Using Nanoelectromechanical RelaysIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2021.311562229:11(1981-1993)Online publication date: Nov-2021
  • (2021)Design and Demonstration of MEM Relay-Based Arithmetic and Sequential Circuit BlocksIEEE Transactions on Electron Devices10.1109/TED.2021.311866368:12(6415-6421)Online publication date: Dec-2021
  • (2021)Design and Demonstration of Micro-Electromechanical Resonator-Based Multipliers2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)10.1109/MEMS51782.2021.9375351(603-606)Online publication date: 25-Jan-2021
  • (2020)Design of almost-nonvolatile embedded DRAM using nanoelectromechanical relay devicesProceedings of the 23rd Conference on Design, Automation and Test in Europe10.5555/3408352.3408630(1223-1228)Online publication date: 9-Mar-2020
  • (2020)Design of Almost-Nonvolatile Embedded DRAM Using Nanoelectromechanical Relay Devices2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)10.23919/DATE48585.2020.9116237(1223-1228)Online publication date: Mar-2020
  • (2019)Modeling and Simulation of A MEMS Resonator Based Reprogrammable Logic Gate Using Partial Electrodes2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)10.1109/DTIP.2019.8752880(1-5)Online publication date: May-2019
  • (2018)Design and Demonstration of A Compact Full Adder Using Micro-beam Resonators2018 IEEE 61st International Midwest Symposium on Circuits and Systems (MWSCAS)10.1109/MWSCAS.2018.8624042(623-626)Online publication date: Aug-2018
  • (2016)Thwarting timing attacks on NEMS relay based designs2016 IEEE 34th VLSI Test Symposium (VTS)10.1109/VTS.2016.7477294(1-4)Online publication date: Apr-2016
  • (2016)Adhesion Limits and Design Criteria for NanorelaysIEEE Transactions on Electron Devices10.1109/TED.2015.249615563:1(465-470)Online publication date: Jan-2016
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