Jhih-Rong Gao
ABSTRACT
Optical Proximity Correction (OPC) has been widely adopted for resolution enhancement to achieve nanolithography. However, conventional rule-based and model-based OPCs encounter severe difficulties at advanced technology nodes. Inverse Lithography Technique (ILT) that solves the inverse problem of the imaging system becomes a promising solution for OPC. In this paper, we consider simultaneously 1) the design target optimization under nominal process condition and 2) process window minimization with different process corners, and solve the mask optimization problem based on ILT. The proposed method is tested on 32nm designs released by IBM for the ICCAD 2013 contest. Our optimization is implemented in two modes, MOSAIC_fast and MOSAIC_exact, which outperform the first place winner of the ICCAD 2013 contest by 7% and 11%, respectively.
- A. K. Wong. Resolution enhancement techniques. SPIE Press, 2001.Google Scholar
- N. B. Cobb and Y. Granik. OPC methods to improve image slope and process window. In Proc. of SPIE, 2003.Google ScholarCross Ref
- P. Yu and D. Z. Pan. TIP-OPC: a new topological invariant paradigm for pixel based optical proximity correction. In Proc. Int. Conf. on Computer Aided Design, 2007. Google ScholarDigital Library
- Y. Granik. Illuminator optimization methods in microlithography. In Proc. of SPIE, volume 5754, 2005.Google Scholar
- L. Pang, Y. Liu, and D. Abrams. Inverse lithography technology (ILT): What is the impact to the photomask industry? In Proc. of SPIE, volume 6283, 2006.Google ScholarCross Ref
- Guangming Xiao, Dong Hwan Son, Tom Cecil, Dave Irby, David Kim, Ki-Ho Baik, Byung-Gook Kim, SungGon Jung, Sung Soo Suh, and HanKu Cho. E-beam writing time improvement for inverse lithography technology mask for full-chip. In Proc. of SPIE, volume 7748, 2010.Google ScholarCross Ref
- Y. Granik. Fast pixel-based mask optimization for inverse lithography. Journal of Micro/Nanolithography, MEMS, and MOEMS, 5(4), 2006.Google Scholar
- Y. Shen, N. Wong, and E. Y. Lam. Level-set-based inverse lithography for photomask synthesis. Optics Express, 17(26), 2009.Google Scholar
- A. Poonawala and P. Milanfar. Mask design for optical microlithography mdash;An inverse imaging problem. IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 16(3), 2007. Google ScholarDigital Library
- X. Ma and G. R. Arce. Generalized inverse lithography methods for phase-shifting mask design. In Optics Express, volume 15, 2007.Google ScholarCross Ref
- N. Jia and E. Y. Lam. Machine learning for inverse lithography: using stochastic gradient descent for robust photomask synthesis. Journal of Optics, 12(4), 2010.Google ScholarCross Ref
- X. Zhao and C. Chu. Line search-based inverse lithography technique for mask design. Proc. Int. Conf. on VLSI Design, 2012. Google ScholarDigital Library
- Jinyu Zhang, Wei Xiong, Yan Wang, and Zhiping Yu. A highly efficient optimization algorithm for pixel manipulation in inverse lithography technique. In Proc. Int. Conf. on Computer Aided Design, November 2008. Google ScholarDigital Library
- Jinyu Zhang, Wei Xiong, Yan Wang, Zhiping Yu, and Min-Chun Tsai. A robust pixel-based RET optimization algorithm independent of initial conditions. In Proc. Asia and South Pacific Design Automation Conf., January 2010. Google ScholarDigital Library
- A. Krasnoperova, J. A. Culp, I. Graur, S. Mansfield, M. Al-Imam, and H. Maaty. Process window OPC for reduced process variability and enhanced yield. In Proc. of SPIE, volume 6154, 2006.Google ScholarCross Ref
- P.Yu, S.X. Shi, and D. Z. Pan. True process variation aware optical proximity correction with variational lithography modeling and model calibration. Journal of Micro/Nanolithography, MEMS, and MOEMS, 6(3), 2007.Google ScholarCross Ref
- S. Banerjee, K. B. Agarwal, and M. Orshansky. Methods for joint optimization of mask and design targets for improving lithographic process window. Journal of Micro/Nanolithography, MEMS, and MOEMS, 12(2), 2013.Google ScholarCross Ref
- H. Hopkins. The concept of partial coherence in optics. Proceedings of the Royal Society of London, 1953.Google Scholar
- N. Cobb. Fast optical and process proximity correction algorithms for integrated circuit manufacturing. PhD dissertation, University of California at Berkeley, 1998. Google ScholarDigital Library
- J. A. Torres and C. N. Berglund. Integrated circuit DFM framework for deep subwavelength processes. In Proc. of SPIE, volume 5756, 2005.Google Scholar
- X. Ma and G. R. Arce. Computational Lithography. Wiley Series in Pure and Applied Optics, first edition, 2010.Google Scholar
- ICCAD contest 2013 {http://cad_contest.cs.nctu.edu.tw/CAD-contest-at-ICCAD2013/problem_c/}.Google Scholar
- MOSAIC: Mask Optimizing Solution With Process Window Aware Inverse Correction
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