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A Cross-Layer Approach for Early-Stage Power Grid Design and Optimization

Published: 21 September 2015 Publication History

Abstract

Power integrity has become increasingly important for sub-32nm designs. Many prior works have discussed power grid design and optimization in the post-layout stage, when design change is inevitably expensive and difficult. In contrast, during the early stage of a development cycle, designers have more flexibility to improve the design quality. However, there are several fundamental challenges at early stage when the design database is not complete, including extraction, modeling, and optimization. This article tackles these fundamental issues of early-stage power grid design from architecture to layout. The proposed methods have been silicon validated on 32nm on-market chips and successfully applied to a 22nm design for its early-stage power grid design. The findings from such practices reveal that, for sub-32nm chips, an intrinsic on-die capacitance and power gate scheme may have more significant impact than expected on power integrity, and needs to be well addressed at early stage.

References

[1]
G. Antonini. 2003. SPICE equivalent circuits of frequency domain responses. IEEE Trans. Electromagnetic Compatabil. 45, 3, 502--512.
[2]
K. Arabi, R. Saleh, and X. Meng. 2007. Power supply noise in SoCs: Metrics, management, and measurement. IEEE Des. Test Comput. 24, 3, 236--244.
[3]
T. H. Chen and C. C.-P. Chen. 2001. Efficient large-scale power grid analysis based on preconditioned Krylov-subspace iterative methods. In Proceedings of the Design Automation Conference (DAC'01). 559--562.
[4]
E. Chiprout. 2004. Fast flip-chip power grid analysis via locality and grid shells. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD'04). 485--488.
[5]
A. Dharchoudhury, R. Panda, D. Blaauw, R. Vaidyanathan, B. Tutuianu, and D. Bearden. 1998. Design and analysis of power distribution networks in PowerPCTM microprocessors. In Proceedings of the Design Automation Conference (DAC'98). 738--743.
[6]
Z. Feng and P. Li. 2008. Multigrid on GPU: Tackling power grid analysis on parallel SIMT platforms. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD'08). 647--654.
[7]
N. Ghani and F. Najm. 2005. Fast vectorless power grid verification using an approximate inverse technique. In Proceedings of the Design Automation Conference (DAC'05). 184--189.
[8]
Q. He, D. Chen, and D. Jiao. 2012. From layout directly to simulation: A first-principle guided circuit simulator of linear complexity and its efficient parallelization. IEEE Trans. Compon. Packag. Manufact. Technol. 2, 4, 687--699.
[9]
A. Husain. 2001. Models for interconnect capacitance extraction. In Proceedings of the International Symposium on Quality Electronic Design (ISQED'01). 167--172.
[10]
Y. Jiang and K. Cheng. 2001. Vector generation for power supply noise estimation and verification of deep submicron designs. IEEE Trans. VLSI Syst. 9, 2, 329--340.
[11]
H. Jiang and M. Marek-Sadowska. 2008. Power gating scheduling for power/ground noise reduction. In Proceedings of the Design Automation Conference (DAC'08). 980--985.
[12]
H. Jiang, M. Marek-Sadowska, and S. Nassif. 2005. Benefits and costs of power-gating technique. In Proceedings of the International Conference on Computer Design (ICCD'05). 559--566.
[13]
W. Kao, C. Lo, M. Basel, and R. Singh. 2001. Parasitic extraction: Current state of the art and future trends. Proc. IEEE 89, 5, 729--739.
[14]
J. Kozhaya, S. Nassif, and F. Najm. 2002. A multigrid-like technique for power grid analysis. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 21, 10, 1148--1160.
[15]
Y. Le Coz and R. Iverson. 1992. A stochastic algorithm for high speed capacitance extraction in integrated circuits. Solid-State Electron. 35, 7, 1005--1012.
[16]
Y. Le Coz and J. Jere. 1993. An improved floating-random-walk algorithm for solving the multi-dielectric Dirichlet problem. IEEE Trans. Microwave Theory Techniq. 41, 2, 325--329.
[17]
L. Lee, Y. Cao, T. Chen, J. Wang, and C. C.-P. Chen. 2005. HiPRIME: Hierarchical and passivity preserved interconnect macromodeling engine for RLKC power delivery. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 24, 5, 797--806.
[18]
S. Lin, M. Nagata, K. Shimazaki, K. Satoh, M. Sumita, H. Tsujikawa, and A. Yang. 2004. Full-chip vectorless dynamic PI analysis and verification against 100uV/100ps-resolution measurement. In Proceedings of the Custom Integrated Circuits Conference (CICC'04). 509--512.
[19]
Y. Liu, B. Wang, M. Xu, X. Liu, J. Chen, and M. Desmith. 2008. Correlation of on-die capacitance for power delivery network. In Proceedings of the IEEE-EPEP Conference on Electrical Performance on Electronic Packaging (EPEP'08). 123--126.
[20]
C. Long and L. He. 2004. Distributed sleep transistor network for power reduction. IEEE Trans. VLSI Syst. 12, 9, 937--946.
[21]
K. Mattan, S. McCormick, and K. Shepard. 1999. Interconnect parasitic extraction in the digital IC design methodology. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD'99). 223--230.
[22]
R. Panda, D. Blaaiw, R. Chaudhry, V. Zolotov, B. Young, and R. Ramaraju. 2000. Model and analysis for combined package and on-chip power grid simulation. In Proceedings of the International Symposium on Low Power Electronics and Design (ISLPED'00). 179--284.
[23]
J. Phillips and L. Silveira. 2004. Poor man's TBR: A simple model reduction scheme. In Proceedings of the Design, Automation, and Test in Europe Conference (DATE'04). 938--943.
[24]
H. Qian, S. Nassif, and S. Sapatnekar. 2005a. Power grid analysis using random walks. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 24, 8, 1204--1224.
[25]
H. Qian, S. Nassif, and S. Sapatnekar. 2005b. Early-stage power grid analysis for uncertain working modes. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 24, 5, 676--682.
[26]
Y. Shi and L. He. 2010. Modeling and design for beyond-the-die power integrity. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD'10). 411--416.
[27]
J. Singh and S. Sapatnekar. 2005. A fast algorithm for power grid design. In Proceedings of the International Symposium on Physical Design (ISPD'05). 70--77.
[28]
X.-D. S. Tan and C.-J. R. Shi. 2001. Fast power/ground network optimization based on equivalent circuit modeling. In Proceedings of the Design Automation Conference (DAC'01). 550--554.
[29]
J. Zhao, J. Zhang, and J. Fang. 1998. Effects of power/ground via distribution on the power/ground performance of C4/BGA packages. In Proceedings of the IEEE Topical Meeting on Electrical Performance on Electronic Packaging (EPEP'98). 177--180.
[30]
H. Zheng, B. Krauter, and L. Pileggi. 2003. On-package decoupling optimization with package macromodels. In Proceedings of the Custom Integrated Circuits Conference (CICC'03). 723--726.
[31]
C. Zhuo, J. Hu, M. Zhao, and K. Chen. 2009. Power grid analysis and optimization using algebraic multigrid. IEEE Trans. Comput.-Aided Des. Circ. Syst. 27, 4, 738--751.
[32]
C. Zhuo, G. Wilke, R. Chakraborty, A. Aydiner, S. Chakravarty, and W. Shih. 2012. A silicon-validated methodology for power delivery modeling and simulation. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD'12). 255--262.
[33]
C. Zhuo, H. Gan, and W. Shih. 2014. Early-stage power grid design: Extraction, modeling and optimization. In Proceedings of the Design Automation Conference (DAC'14). 1--6.

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    cover image ACM Journal on Emerging Technologies in Computing Systems
    ACM Journal on Emerging Technologies in Computing Systems  Volume 12, Issue 3
    Special Issue on Cross-Layer System Design and Regular Papers
    September 2015
    207 pages
    ISSN:1550-4832
    EISSN:1550-4840
    DOI:10.1145/2828988
    Issue’s Table of Contents
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 21 September 2015
    Accepted: 01 September 2014
    Revised: 01 September 2014
    Received: 01 June 2014
    Published in JETC Volume 12, Issue 3

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    Author Tags

    1. Parasitics extraction
    2. power gating
    3. power grid
    4. synthesis
    5. topology

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    • (2023)Agile Full-Chip Sign-Off in the Post-Moore Era2023 China Semiconductor Technology International Conference (CSTIC)10.1109/CSTIC58779.2023.10219241(1-5)Online publication date: 26-Jun-2023
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    • (2019)A Cross-Layer Framework for Temporal Power and Supply Noise PredictionIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.287182038:10(1914-1927)Online publication date: 17-Sep-2019
    • (2019)From Layout to System: Early Stage Power Delivery and Architecture Co-ExplorationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.283443838:7(1291-1304)Online publication date: Jul-2019
    • (2019)Revisiting EAVP for Power Delivery Decoupling Optimization2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)10.1109/EMCCompo.2019.8919705(129-131)Online publication date: Oct-2019
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