Throwing buddy: solving sensor challenges through soft-good construction, design, and fabric selection
Pages 1319 - 1325
Abstract
Wearable technology projects sometimes present complex problems, which are hard to solve through computer science solutions alone. Our interdisciplinary team met such a problem in the form of near infrared sensor noise due to fabric interference. We met the challenge through software/hardware solutions, but also strategic fabric selection and soft-good construction. This case study shows how incorporating everyone's expertise on an interdisciplinary team can afford solutions, which better accomplish the goals of a project than individual disciplines could alone.
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Index Terms
- Throwing buddy: solving sensor challenges through soft-good construction, design, and fabric selection
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Information & Contributors
Information
Published In
September 2015
1626 pages
ISBN:9781450335751
DOI:10.1145/2800835
- General Chairs:
- Kenji Mase,
- Marc Langheinrich,
- Daniel Gatica-Perez,
- Program Chairs:
- Hans Gellersen,
- Tanzeem Choudhury,
- Koji Yatani
Copyright © 2015 Owner/Author.
Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.
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- Yahoo! Japan: Yahoo! Japan
- SIGMOBILE: ACM Special Interest Group on Mobility of Systems, Users, Data and Computing
- FX Palo Alto Laboratory, Inc.: FX Palo Alto Laboratory, Inc.
- Google Inc.
- ACM: Association for Computing Machinery
- Rakuten Institute of Technology: Rakuten Institute of Technology
- Microsoft: Microsoft
- Bell Labs: Bell Laboratories
- SIGCHI: ACM Special Interest Group on Computer-Human Interaction
- KDDI
- Panasonic: Panasonic Corporation
- NTT DoCoMo
- Telefónica: Telefónica
- ISTC-PC: Intel Science and Technology Center for Pervasive Computing
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Association for Computing Machinery
New York, NY, United States
Publication History
Published: 07 September 2015
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UbiComp '15
UbiComp '15: The 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing
September 7 - 11, 2015
Osaka, Japan
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Overall Acceptance Rate 764 of 2,912 submissions, 26%
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