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Asymmetric Underlapped FinFETs for Near- and Super-Threshold Logic at Sub-10nm Technology Nodes

Published: 02 November 2016 Publication History

Abstract

Extending double-gate FinFET scaling to sub-10nm technology regime requires device-engineering techniques for countering the rise of direct source to drain tunneling (DSDT), edge direct tunneling (EDT) and short channel effects (SCE) that degrade FinFET I-V characteristics. Symmetric underlap is effective for eliminating EDT, diminishing DSDT, and lowering the fringe component of gate capacitance. However, excessive symmetric underlap also lowers the on-current, which is mainly due to thermionic emission. In this work, it is demonstrated that at sub-10nm node, asymmetric underlapped FinFETs with slightly longer underlap toward drain side than source side are superior to symmetric underlapped FinFETs due to further improvement in Ion/Ioff and reduction in gate-to-drain capacitance. Using quantum mechanical device simulations, FinFETs with various degrees of underlap have been analyzed for improvement in I-V characteristics. A FinFET model for circuit simulations has been constructed that captures the major sub-10nm leakage components, namely, thermionic emission, DSDT, EDT, direct gate oxide tunneling and its associated components. By simulating a 10-stage NAND circuit and a LEON3 processor with interconnect parasitics using these devices, it is shown that asymmetric underlap instead of symmetric underlap in sub-10nm FinFETs can offer lower energy consumption with improved performance for near-threshold logic and higher energy-efficiency for super-threshold logic operation.

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  • (2021)Performance Improvement of 1T DRAM by Raised Source and Drain EngineeringIEEE Transactions on Electron Devices10.1109/TED.2021.305695268:4(1577-1584)Online publication date: Apr-2021

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      cover image ACM Journal on Emerging Technologies in Computing Systems
      ACM Journal on Emerging Technologies in Computing Systems  Volume 13, Issue 2
      Special Issue on Nanoelectronic Circuit and System Design Methods for the Mobile Computing Era and Regular Papers
      April 2017
      377 pages
      ISSN:1550-4832
      EISSN:1550-4840
      DOI:10.1145/3014160
      • Editor:
      • Yuan Xie
      Issue’s Table of Contents
      Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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      Publication History

      Published: 02 November 2016
      Accepted: 01 June 2016
      Revised: 01 April 2016
      Received: 01 September 2015
      Published in JETC Volume 13, Issue 2

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      Author Tags

      1. Asymmetric underlap
      2. LEON3 processor
      3. direct source to drain tunneling
      4. leakage
      5. near-threshold
      6. optimization
      7. quantum simulation
      8. short channel effects
      9. super-threshold

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      • DARPA under the PERFECT program

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      • (2021)Performance Improvement of 1T DRAM by Raised Source and Drain EngineeringIEEE Transactions on Electron Devices10.1109/TED.2021.305695268:4(1577-1584)Online publication date: Apr-2021

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