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Where the curb meets the cloud: urban innovation in the digital age

Published:03 October 2016Publication History

ABSTRACT

Cities have benefited from the three greatest technological innovations of the past 200 years: the steam engine, electrification, and the automobile. But each advance has created its own challenges, including pollution, overcrowding, sprawl. As the digital revolution transforms cities once again, how can we make sure it improves quality of life while minimizing the downside? With population density comes the possibility of deploying network connectivity and wayfinding at lower cost, but density also increases complexity of deployment. How can digital technology reduce the bad friction of urban environments, such as congestion, cost, and complexity, while increasing good friction, such as all of the serendipitous interactions that cities encourage? Underlying all this change is ubiquitous connectivity and mobile technology, from the phones people carry with them to the supporting devices and network endpoints embedded in the urban infrastructure. Sidewalk Labs is an Alphabet company that works with cities to develop new technology that can improve urban life. We will discuss some of our discoveries and beliefs, and talk about our plans to use mobile technology to help cities take full advantage of the digital revolution.

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  1. Where the curb meets the cloud: urban innovation in the digital age

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      • Published in

        cover image ACM Other conferences
        MobiCom '16: Proceedings of the 22nd Annual International Conference on Mobile Computing and Networking
        October 2016
        532 pages
        ISBN:9781450342261
        DOI:10.1145/2973750

        Copyright © 2016 Owner/Author

        Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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        Association for Computing Machinery

        New York, NY, United States

        Publication History

        • Published: 3 October 2016

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        Acceptance Rates

        MobiCom '16 Paper Acceptance Rate31of226submissions,14%Overall Acceptance Rate440of2,972submissions,15%
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