Three-dimensional DRAMs (3D-DRAMs) are emerging as a promising solution to address the memory wall problem in computer systems. However, high fabrication cost per bit and thermal issues are the main reasons that prevent architects from using 3D-DRAM ...
One of the main challenges for embedded systems is the transfer of data between memory and processor. In this context, Hybrid Memory Cubes (HMCs) can provide substantial energy and bandwidth improvements compared to traditional memory organizations, ...
Processing in Memory (PIM) was first proposed decades ago for reducing the overhead of data movement between core and memory. With the advances in 3D-stacking technologies, recently PIM architectures have regained researchers' attentions. Several fully-...
Association for Computing Machinery
New York, NY, United States
Check if you have access through your login credentials or your institution to get full access on this article.
Sign in