Cited By
View all- Feng CAresti LZhang PWang DZhao WChristodoulides P(2025)Smart cooling: Hydrogel-enhanced adaptive jet impingement utilizing through silicon via for integrated microsystemsApplied Thermal Engineering10.1016/j.applthermaleng.2025.125895268(125895)Online publication date: Jun-2025
- Hu RLu LBai ZYang FMa KDing Z(2024)Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon viasIEICE Electronics Express10.1587/elex.21.2024018521:11(20240185-20240185)Online publication date: 10-Jun-2024
- Yao Y(2023)Game-of-Life Temperature-Aware DVFS Strategy for Tile-Based Chip Many-Core ProcessorsIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2023.324476313:1(58-72)Online publication date: Mar-2023
- Show More Cited By