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Communication optimization for thermal reliable many-core systems: work-in-progress

Published: 15 October 2017 Publication History

Abstract

System-level thermal management techniques normally map applications on non-adjacent cores to guarantee the safe temperature in many-core systems, while the communication efficiency will be oppositely affected by long-distance data transmission over conventional Network-on-Chips (NoC). SMART NoC has enabled single-cycle multi-hop bypass channels between distant cores, which can significantly reduce inter-processor communication latency. However, communication efficiency of SMART will be significantly diminished by express bypass break due to communication conflict. In order to achieve communication optimization with guaranteed system thermal reliability, we propose a dynamic reconfiguration method for logical interconnection topology through task mapping on top of SMART NoC. Active cores are physically decentralized on chip for better heat dissipation, while communication overhead can be reduced by minimized communication conflict and maximized bypass routing. Applicability and effectiveness of the proposed technique can be improved with significant achievements in reducing communication overhead and improving application performance, compared with state-of-the-art techniques.

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Cited By

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  • (2021)The Performance Analysis of Thermal Effect in Mesh-Based Optical Networks-on-ChipsIEEE Photonics Journal10.1109/JPHOT.2021.310631813:4(1-12)Online publication date: Aug-2021

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cover image ACM Other conferences
CODES '17: Proceedings of the Twelfth IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis Companion
October 2017
84 pages
ISBN:9781450351850
DOI:10.1145/3125502
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 15 October 2017

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  • Research-article

Funding Sources

  • National 863 Program
  • Chongqing High-Tech Research Program, China
  • National Natural Science Foundation of China (NSFC)

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ESWEEK'17
ESWEEK'17: THIRTEENTH EMBEDDED SYSTEM WEEK
October 15 - 20, 2017
Seoul, Republic of Korea

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Overall Acceptance Rate 280 of 864 submissions, 32%

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View all
  • (2021)The Performance Analysis of Thermal Effect in Mesh-Based Optical Networks-on-ChipsIEEE Photonics Journal10.1109/JPHOT.2021.310631813:4(1-12)Online publication date: Aug-2021

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