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- Wang CVafai K(2024)Heat transfer enhancement for 3D chip thermal simulation and predictionApplied Thermal Engineering10.1016/j.applthermaleng.2023.121499236(121499)Online publication date: Jan-2024
- Nayak BRay B(2023)ISP: An Improved Slicing Pair Code for Skewed Slicing Floorplan2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID)10.1109/VLSID57277.2023.00051(205-210)Online publication date: Jan-2023
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