research-article

Impact of memory frequency scaling on user-centric smartphone workloads

Authors:

L. S. Indrusiak,

Pi-Cheng HsiuAuthors Info & Claims

SAC '18: Proceedings of the 33rd Annual ACM Symposium on Applied Computing

Pages 567 - 574

https://doi.org/10.1145/3167132.3167194

Published: 09 April 2018 Publication History

Abstract

Improving battery life in mobile phones has become a top concern with the increase in memory and computing requirements of applications with tough quality-of-service needs. Many energy-efficient mobile solutions vary the CPU and GPU voltage/frequency to save power consumption. However, energy-aware control over the memory bus connecting the various on-chip subsystems has had much less interest. This measurement-based study first analyse the CPU, GPU and memory cost (i.e. product of utilisation and frequency) of user-centric smartphone workloads. The impact of memory frequency scaling on power consumption and quality-of-service is also measured. We also present a preliminary analysis into the frequency levels selected by the different default governors of the CPU/GPU/memory components. We show that an interdependency exists between the CPU and memory governors and that it may cause unnecessary increase in power consumption, due to interference with the CPU frequency governor. The observations made in this measurement-based study can also reveal some design insights to system designers.

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Cited By

Dey SIsuwa SSaha SSingh AMcDonald-Maier K(2022)CPU-GPU-Memory DVFS for Power-Efficient MPSoC in Mobile Cyber Physical SystemsFuture Internet10.3390/fi1403009114:3(91)Online publication date: 14-Mar-2022
https://doi.org/10.3390/fi14030091
Lee JKim HPark SChun J(2020)A Dual-Mode Ground-Referenced Signaling Transceiver with a 3-Tap Feed-Forward Equalizer for Memory Interfaces2020 IEEE Asian Solid-State Circuits Conference (A-SSCC)10.1109/A-SSCC48613.2020.9336112(1-4)Online publication date: 9-Nov-2020
https://doi.org/10.1109/A-SSCC48613.2020.9336112

Index Terms

Impact of memory frequency scaling on user-centric smartphone workloads
1. Computer systems organization
  1. Embedded and cyber-physical systems
    1. Embedded systems
2. Hardware
  1. Very large scale integration design
    1. Design reuse and communication-based design
      1. System on a chip

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Published In

cover image ACM Conferences

SAC '18: Proceedings of the 33rd Annual ACM Symposium on Applied Computing

April 2018

2327 pages

ISBN:9781450351911

DOI:10.1145/3167132

Conference Chairs:
Hisham M. Haddad
Kennesaw State University
,
Roger L. Wainwright
University of Tulsa
,
Richard Chbeir
University of Pau & Pays Adour, France

Copyright © 2018 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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SIGAPP: ACM Special Interest Group on Applied Computing

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 09 April 2018

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HiPEAC 2016 collaboration grant (The FP7 HiPEAC Network of Excellence)

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SAC 2018

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SAC 2018: Symposium on Applied Computing

April 9 - 13, 2018

Pau, France

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Overall Acceptance Rate 1,650 of 6,669 submissions, 25%

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The 40th ACM/SIGAPP Symposium on Applied Computing

March 31 - April 4, 2025

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Cited By

Dey SIsuwa SSaha SSingh AMcDonald-Maier K(2022)CPU-GPU-Memory DVFS for Power-Efficient MPSoC in Mobile Cyber Physical SystemsFuture Internet10.3390/fi1403009114:3(91)Online publication date: 14-Mar-2022
https://doi.org/10.3390/fi14030091
Lee JKim HPark SChun J(2020)A Dual-Mode Ground-Referenced Signaling Transceiver with a 3-Tap Feed-Forward Equalizer for Memory Interfaces2020 IEEE Asian Solid-State Circuits Conference (A-SSCC)10.1109/A-SSCC48613.2020.9336112(1-4)Online publication date: 9-Nov-2020
https://doi.org/10.1109/A-SSCC48613.2020.9336112

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