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View all- Shih MChen THuang BPan CWang CHung C(2025)Thermal Characteristics Analysis and Optimization of Heterogeneous 2.5-D Package Under System-Level ConditionsIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2024.346727415:1(157-164)Online publication date: Jan-2025
- Deng LSun NFu N(2020)Boundary scan based interconnect testing design for silicon interposer in 2.5D ICsIntegration, the VLSI Journal10.1016/j.vlsi.2020.02.00672:C(171-182)Online publication date: 1-May-2020