Ali Abbasinasab
ABSTRACT
In this paper, we study the main interconnect aging processes: electromigration, thermomigration and stress migration and propose comprehensive yet compact models for transient and steady states based on hydrostatic stress evolution. Our model can be expressed in terms of voltages only which abstracts away the hydrostatic stress. The model also explains some experimental observations, introduces temperature-dependent Blech's length criterion and a new time-to-failure formula replacing Black's empirical model. A tool is developed based on the proposed model which assesses reliability of multi-segment complex interconnect networks. Experimental results obtained on IBM benchmarks validate the model.
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- A. Abbasinasab and M. Marek-Sadowska. "Blech effect in interconnects: Applications and design guidelines." Proc. ACM Int. Symp. on Physical Design, 2015. Google ScholarDigital Library
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- Nassif, Sani R. "Power grid analysis benchmarks." Design Automation Conference, 2008. ASPDAC 2008. Asia and South Pacific. IEEE, 2008. (IBM) Google ScholarDigital Library
- RAIN (tool), available {online} https://github.com/abbasinasab/rainGoogle Scholar
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