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Phone-nomenon: a system-level thermal simulator for handheld devices

Published: 21 January 2019 Publication History

Abstract

This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3.58% maximum error and 1.72°C difference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well.

References

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S. Pagani, J. J. Chen, M. Shafique, and J. Henkel. MatEx: Efficient transient and peak temperature computation for compact thermal models. In DATE, pages 1515--20, 2015.
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Q. Xie, M. J. Dousti, and Pedram M. Therminator: a thermal simulator for smartphones producing accurate chip and skin temperature maps. In ISLPED., pages 117--22, 2014.
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ANSYS Icepak 17.0. ANSYS, Inc., 2017.
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Y. K. Cheng. Electrothermal analysis of VLSI systems. Springer, 2000.
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D. L. Carroll, H. Y. Lo, and L. I. Stiel. Thermal conductivity of gaseous air at moderate and high pressures. Journal of Chemical and Engineering Data 13.1, pages 53--57, 1968.
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SuperLU, http://crd-legacy.lbl.gov/xiaoye/SuperLU/.
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B. Siegal and J. Galloway. Thermal test chip design and performance considerations. In SEMI-THERM, pages 59--62, 2008.
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EIA/JEDEC standard JESD51-2a integrated circuits thermal test method environmental conditions - natural convection. In Electronic Industries Association, JC15 committee, 1995.
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Therminator, http://sportlab.usc.edu/downloads/packages/.

Cited By

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  • (2023)Phone‐nomenon 2.0: A compact thermal model for smartphonesIET Computers & Digital Techniques10.1049/cdt2.1205217:2(43-59)Online publication date: 8-Jan-2023
  • (2021)DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)10.1109/ITherm51669.2021.9503154(477-483)Online publication date: 1-Jun-2021
  • (2021)Thermal Pad Design Flow for Automotive Electronics2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)10.1109/ICCE-TW52618.2021.9603076(1-2)Online publication date: 15-Sep-2021
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cover image ACM Conferences
ASPDAC '19: Proceedings of the 24th Asia and South Pacific Design Automation Conference
January 2019
794 pages
ISBN:9781450360074
DOI:10.1145/3287624
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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  • IEICE ESS: Institute of Electronics, Information and Communication Engineers, Engineering Sciences Society
  • IEEE CAS
  • IEEE CEDA
  • IPSJ SIG-SLDM: Information Processing Society of Japan, SIG System LSI Design Methodology

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 21 January 2019

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Cited By

View all
  • (2023)Phone‐nomenon 2.0: A compact thermal model for smartphonesIET Computers & Digital Techniques10.1049/cdt2.1205217:2(43-59)Online publication date: 8-Jan-2023
  • (2021)DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)10.1109/ITherm51669.2021.9503154(477-483)Online publication date: 1-Jun-2021
  • (2021)Thermal Pad Design Flow for Automotive Electronics2021 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)10.1109/ICCE-TW52618.2021.9603076(1-2)Online publication date: 15-Sep-2021
  • (2020)Temperature-to-Power Mapping for Smartphones2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)10.1109/ITherm45881.2020.9190487(783-789)Online publication date: Jul-2020
  • (2019)Learning Based Mesh Generation for Thermal Simulation in Handheld Devices with Variable Power Consumption2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)10.1109/ITHERM.2019.8757347(7-12)Online publication date: May-2019

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