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Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices

Published: 21 January 2019 Publication History

Abstract

Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.

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L. L. Jiang, Y. Tang, and M. Q. Pan, "Effects of bending on heat transfer performance of axial micro-grooved heat pipe," Journal of Central South University of Technology, vol. 18, no. 2, p. 580, 2011.
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Cited By

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  • (2021)Biomimetic Copper Forest Wick Enables High Thermal Conductivity Ultrathin Heat PipeACS Nano10.1021/acsnano.0c0996115:4(6614-6621)Online publication date: 1-Apr-2021

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cover image ACM Conferences
ASPDAC '19: Proceedings of the 24th Asia and South Pacific Design Automation Conference
January 2019
794 pages
ISBN:9781450360074
DOI:10.1145/3287624
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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  • IEICE ESS: Institute of Electronics, Information and Communication Engineers, Engineering Sciences Society
  • IEEE CAS
  • IEEE CEDA
  • IPSJ SIG-SLDM: Information Processing Society of Japan, SIG System LSI Design Methodology

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Association for Computing Machinery

New York, NY, United States

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Published: 21 January 2019

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  • (2021)Biomimetic Copper Forest Wick Enables High Thermal Conductivity Ultrathin Heat PipeACS Nano10.1021/acsnano.0c0996115:4(6614-6621)Online publication date: 1-Apr-2021

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