Abhishek Koneru
Krishnendu Chakrabarty
ABSTRACT
M3D integration can result in reduced area and higher performance when compared to 3D die stacking. Due to the benefits of M3D integration, there is growing interest in industry towards the adoption of this technology. However, test challenges for M3D integration have remained largely unexplored. We present three key test challenges for M3D integration: (i) performance variations due to high-density integration, (ii) defect analysis and modeling, and (iii) defect isolation and yield enhancement. For each test challenge, we motivate the need to study its impact on an M3D IC, analyze the effectiveness of existing test solutions, and propose new solutions.
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Index Terms
- Test and Design-for-Testability Solutions for Monolithic 3D Integrated Circuits
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