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- Hong FMyant CBoyle DKitamura YQuigley AIsbister KIgarashi TBjørn PDrucker S(2021)Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bendingProceedings of the 2021 CHI Conference on Human Factors in Computing Systems10.1145/3411764.3445469(1-10)Online publication date: 6-May-2021