research-article

A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS

Authors:

Kota Shiba,

Tatsuo Omori,

Mototsugu Hamada,

Tadahiro KurodaAuthors Info & Claims

ASPDAC '21: Proceedings of the 26th Asia and South Pacific Design Automation Conference

Pages 97 - 98

https://doi.org/10.1145/3394885.3431642

Published: 29 January 2021 Publication History

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ASPDAC '21: Proceedings of the 26th Asia and South Pacific Design Automation Conference

A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS

Pages 97 - 98

Abstract
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Abstract

A 3D-stacked SRAM using an inductive coupling wireless inter-chip communication technology (TCI) is presented for an AI inference accelerator. The energy and area efficiency are improved thanks to the introduction of a proposed low-voltage NMOS push-pull transmitter and a 12:1 SerDes. A termination scheme to short unused open coils is proposed to eliminate the ringing in an inductive coupling bus. Test chips were fabricated in a 40-nm CMOS technology confirming 0.40-V operation of the proposed transmitter with successful stacked SRAM operation.

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Cited By

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Zhang CSun HLi SWang YChen HLiu H(2023)A Survey of Memory-Centric Energy Efficient Computer ArchitectureIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2023.329759534:10(2657-2670)Online publication date: Oct-2023
https://doi.org/10.1109/TPDS.2023.3297595
Murali GIyer ARavichandran NLim S(2023)3DNN-Xplorer: A Machine Learning Framework for Design Space Exploration of Heterogeneous 3D DNN Accelerators2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323675(1-9)Online publication date: 28-Oct-2023
https://doi.org/10.1109/ICCAD57390.2023.10323675

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ASPDAC '21: Proceedings of the 26th Asia and South Pacific Design Automation Conference

January 2021

930 pages

ISBN:9781450379991

DOI:10.1145/3394885

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

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Published: 29 January 2021

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SIGDA

ASPDAC '21: 26th Asia and South Pacific Design Automation Conference

January 18 - 21, 2021

Tokyo, Japan

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ASPDAC '21 Paper Acceptance Rate 111 of 368 submissions, 30%;

Overall Acceptance Rate 466 of 1,454 submissions, 32%

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Zhang CSun HLi SWang YChen HLiu H(2023)A Survey of Memory-Centric Energy Efficient Computer ArchitectureIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2023.329759534:10(2657-2670)Online publication date: Oct-2023
https://doi.org/10.1109/TPDS.2023.3297595
Murali GIyer ARavichandran NLim S(2023)3DNN-Xplorer: A Machine Learning Framework for Design Space Exploration of Heterogeneous 3D DNN Accelerators2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323675(1-9)Online publication date: 28-Oct-2023
https://doi.org/10.1109/ICCAD57390.2023.10323675

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Total ionizing dose hardness analysis of transistors in commercial 180 nm CMOS technology

Leakage Current Reduction Techniques for 7T SRAM Cell in 45 nm Technology

RF modeling of 40-nm SOI triple-gate FinFET

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