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RIFL: A Reliable Link Layer Network Protocol for FPGA-to-FPGA Communication

Published:17 February 2021Publication History

ABSTRACT

More and more latency-sensitive applications are being introduced into the data center. Performance of such applications can be limited by the high latency of the network interconnect. Because the conventional network stack is designed not only for LAN, but also for WAN, it carries a great amount of redundancy that is not required in a data center network. This paper introduces the concept of a three-layer protocol stack that can replace the conventional network stack and fulfill the exact demands of data center network communications. The detailed design and implementation of the first layer of the stack, which we call RIFL, is presented. A novel low latency in-band hop-by-hop re-transmission protocol is proposed and adopted in RIFL, which guarantees lossless transmission for links whose longest wire segment is no more than 150 meters. Experimental results show that RIFL achieves 218 nanoseconds round-trip latency on 3 meter zero-hop links, at a throughput of 104.7 Gbps. RIFL is a multi-lane protocol with scalable throughput from 500 Mbps to above 200 Gbps. It is portable to most of the recent FPGAs. It can be the enabler of low latency, high throughput, flexible, scalable, and lossless data center networks.

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  1. RIFL: A Reliable Link Layer Network Protocol for FPGA-to-FPGA Communication

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        • Published in

          cover image ACM Conferences
          FPGA '21: The 2021 ACM/SIGDA International Symposium on Field-Programmable Gate Arrays
          February 2021
          240 pages
          ISBN:9781450382182
          DOI:10.1145/3431920

          Copyright © 2021 Owner/Author

          Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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          Association for Computing Machinery

          New York, NY, United States

          Publication History

          • Published: 17 February 2021

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          Acceptance Rates

          Overall Acceptance Rate125of627submissions,20%