FerroTag: When Inkables Meet Wireless Signals
Abstract
References
Recommendations
Stencil mask using ultra-violet-curable positive-tone electron beam resist
AbstractStencil masks are used in fabrication processes such as photolithography for circuit patterning and micro-electromechanical systems devices. A stencil mask has micro- and nano-scale through-hole patterns on a substrate, and the metal ...
Graphical abstractDisplay Omitted
Highlights- Preparation of UV-curable positive-tone EB resist was succeeded.
- Slit and ...
Combination of thick resist and electroforming technologies for monolithic inkjet application
This paper reports a novel method for fabricating a monolithic inkjet chip by combination of thick resist photolithography and electroforming technologies. It integrates two-step photolithography process by two kinds of thick photoresists, SU-8 and JSR, ...
Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste
Thermosonic flip-chip bonding process with a nonconductive paste (NCP) was employed to improve the processability and bonding strength of the flip-chip onto flex substrates (FCOF). A non-conductive paste was deposited on the surface of the copper ...
Comments
Information & Contributors
Information
Published In

Publisher
Association for Computing Machinery
New York, NY, United States
Publication History
Check for updates
Qualifiers
- Research-article
Contributors
Other Metrics
Bibliometrics & Citations
Bibliometrics
Article Metrics
- 0Total Citations
- 82Total Downloads
- Downloads (Last 12 months)9
- Downloads (Last 6 weeks)0
Other Metrics
Citations
View Options
Login options
Check if you have access through your login credentials or your institution to get full access on this article.
Sign in