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Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer

Published:10 October 2021Publication History

ABSTRACT

The spread of personal computer-aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.

References

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  • Published in

    cover image ACM Conferences
    UIST '21 Adjunct: Adjunct Proceedings of the 34th Annual ACM Symposium on User Interface Software and Technology
    October 2021
    182 pages
    ISBN:9781450386555
    DOI:10.1145/3474349

    Copyright © 2021 Owner/Author

    Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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    Association for Computing Machinery

    New York, NY, United States

    Publication History

    • Published: 10 October 2021

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    Overall Acceptance Rate842of3,967submissions,21%

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