ABSTRACT
The spread of personal computer-aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.
- Youngkyung Choi, Neung Ryu, Myung Jin Kim, Artem Dementyev, and Andrea Bianchi. 2020. BodyPrinter: Fabricating Circuits Directly on the Skin at Arbitrary Locations Using a Wearable Compact Plotter. Association for Computing Machinery, New York, NY, USA, 554–564. https://doi.org/10.1145/3379337.3415840Google ScholarDigital Library
- Neil Gershenfeld. 2008. Fab: the coming revolution on your desktop-from personal computers to personal fabrication. Basic Books.Google Scholar
- Daniel Groeger and Jürgen Steimle. 2018. ObjectSkin: Augmenting Everyday Objects with Hydroprinted Touch Sensors and Displays. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 1, 4, Article 134 (Jan. 2018), 23 pages. https://doi.org/10.1145/3161165Google ScholarDigital Library
- Yuhei Imai, Kunihiro Kato, Norihisa Segawa, and Hiroyuki Manabe. 2019. Hot Stamping of Electric Circuits by 3D Printer. In The Adjunct Publication of the 32nd Annual ACM Symposium on User Interface Software and Technology (New Orleans, LA, USA) (UIST ’19). Association for Computing Machinery, New York, NY, USA, 128–130. https://doi.org/10.1145/3332167.3356895Google ScholarDigital Library
- Valkyrie Savage, Xiaohan Zhang, and Björn Hartmann. 2012. Midas: Fabricating Custom Capacitive Touch Sensors to Prototype Interactive Objects. In Proceedings of the 25th Annual ACM Symposium on User Interface Software and Technology(Cambridge, Massachusetts, USA) (UIST ’12). Association for Computing Machinery, New York, NY, USA, 579–588. https://doi.org/10.1145/2380116.2380189Google ScholarDigital Library
- Norihisa Segawa, Kunihiro Kato, and Hiroyuki Manabe. 2019. Rapid Prototyping of Paper Electronics Using a Metal Leaf and Laser Printer. In The Adjunct Publication of the 32nd Annual ACM Symposium on User Interface Software and Technology (New Orleans, LA, USA) (UIST ’19). Association for Computing Machinery, New York, NY, USA, 99–101. https://doi.org/10.1145/3332167.3356885Google ScholarDigital Library
- Tung Ta, Masaaki Fukumoto, Koya Narumi, Shigeki Shino, Yoshihiro Kawahara, and Tohru Asami. 2015. Interconnection and Double Layer for Flexible Electronic Circuit with Instant Inkjet Circuits. In Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing (Osaka, Japan) (UbiComp ’15). Association for Computing Machinery, New York, NY, USA, 181–190. https://doi.org/10.1145/2750858.2804276Google ScholarDigital Library
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