Pingfeng Wu
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- Zhuang S X, Zhang Y Z, Liang M J, Design of the Heat Dissipation Structure and Parameters Optimization in High-power LED Lamp [J].2011,19(4):66-69Google Scholar
- Tang Z W, Guan M, Li Q J, Dong H N, Cai X M. Packaging Technology for Low-Cost and High-Power/High-Brightness LED's [J].2012,37(3)354-357Google Scholar
- Xiong W. Heat Dissipation Analysis and Design of High-power LED Street Lights [D]. Wuhan: Huazhong University of Science and Technology, 2009.Google Scholar
- Wu B B. Numerical Simulation of Heat Treatment Process of Hot-rolled High-strength Seamless Steel Tube [D]. Tianjin: Tianjin University of Technology, 2007.Google Scholar
- Liu B. Analysis on the Temperature Field and Thermal Stress of Power Type LED Package Substrate [J]. Semiconductor Optoelectronics, 2011(05):51-54.Google Scholar
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- Han Y. Design of radiator for high power LED lamps [D]. Beijing:Beijing University of Chemical Technology. 2012.Google Scholar
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