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TailCut: improving performance and lifetime of SSDs using pattern-aware state encoding

Published: 23 August 2022 Publication History

Abstract

Although lateral charge spreading is considered as a dominant error source in 3D NAND flash memory, little is known about its detailed characteristics at the storage system level. From a device characterization study, we observed that lateral charge spreading strongly depends on vertically adjacent state patterns and a few specific patterns are responsible for a large portion of bit errors from lateral charge spreading. We propose a new state encoding scheme, called TailCut, which removes vulnerable state patterns by modifying encoded states. By removing vulnerable patterns, TailCut can improve the SSD lifetime and read latency by 80% and 25%, respectively.

References

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Y. Luo et al., "Improving 3d nand flash memory lifetime by tolerating early retention loss and process variation," ACM on Measurement and Analysis of Computing Systems, vol. 2, no. 3, pp. 1--48, 2018.
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R. Micheloni et al., "Inside nand flash memories," Springer Science & Business Media, 2010.
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C. Kim et al., "A 21 nm High Performance 64 Gb MLC NAND Flash Memory With 400 MB/s Asynchronous Toggle DDR Interface," IEEE J. Solid-State Circuits, vol. 47, no. 4, pp. 981--989, 2012.
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J. Park et al., "Reducing solid-state drive read latency by optimizing read-retry," in Proceedings of the ACM International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS), 2021.
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Cited By

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  • (2024)The design and implementation of a capacity-variant storage systemProceedings of the 22nd USENIX Conference on File and Storage Technologies10.5555/3650697.3650707(159-176)Online publication date: 27-Feb-2024
  • (2024)Reliability Impacts Among Neighboring Wordlines on 3D QLC NAND Flash2024 13th Non-Volatile Memory Systems and Applications Symposium (NVMSA)10.1109/NVMSA63038.2024.10693657(1-6)Online publication date: 21-Aug-2024
  • (2024)RiF: Improving Read Performance of Modern SSDs Using an On-Die Early-Retry Engine2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA)10.1109/HPCA57654.2024.00056(643-656)Online publication date: 2-Mar-2024

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cover image ACM Conferences
DAC '22: Proceedings of the 59th ACM/IEEE Design Automation Conference
July 2022
1462 pages
ISBN:9781450391429
DOI:10.1145/3489517
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Publication History

Published: 23 August 2022

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  • Research-article

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  • National Research Foundation of Korea (NRF)

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DAC '22
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DAC '22: 59th ACM/IEEE Design Automation Conference
July 10 - 14, 2022
California, San Francisco

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

View all
  • (2024)The design and implementation of a capacity-variant storage systemProceedings of the 22nd USENIX Conference on File and Storage Technologies10.5555/3650697.3650707(159-176)Online publication date: 27-Feb-2024
  • (2024)Reliability Impacts Among Neighboring Wordlines on 3D QLC NAND Flash2024 13th Non-Volatile Memory Systems and Applications Symposium (NVMSA)10.1109/NVMSA63038.2024.10693657(1-6)Online publication date: 21-Aug-2024
  • (2024)RiF: Improving Read Performance of Modern SSDs Using an On-Die Early-Retry Engine2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA)10.1109/HPCA57654.2024.00056(643-656)Online publication date: 2-Mar-2024
  • (2023)FSPDA: A Full Sequence Program Data Allocation Scheme for Boosting 3-D nand Flash Read PerformanceIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2023.329445242:12(4336-4349)Online publication date: 11-Jul-2023

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