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Y-architecture-based flip-chip routing with dynamic programming-based bend minimization

Published: 23 August 2022 Publication History

Abstract

In modern VLSI designs, I/O counts have been growing continuously as the system becomes more complicated. To achieve higher routability, the hexagonal array is introduced with higher pad density and a larger pitch. However, the routing for hexagonal arrays is significantly different from that for traditional gird and staggered arrays. In this paper, we consider the Y-architecture-based flip-chip routing used for the hexagonal array. Unlike the conventional Manhattan and the X-architectures, the Y-architecture allows wires to be routed in three directions, namely, 0-, 60-, and 120-degrees. We first analyze the routing properties of the hexagonal array. Then, we propose a triangular tile model and a chord-based internal node division method that can handle both pre-assignment and free-assignment nets without wire crossing. Finally, we develop a novel dynamic programming-based bend minimization method to reduce the number of routing bends in the final solution. Experimental results show that our algorithm can achieve 100% routability with minimized total wirelength and the number of routing bends effectively.

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  • (2024)Physical Design Challenges in Modern Heterogeneous IntegrationProceedings of the 2024 International Symposium on Physical Design10.1145/3626184.3639690(125-134)Online publication date: 12-Mar-2024
  • (2024)Layer and Length-Deviation Limit Aware Interposer Routing for Bend and Wirelength MinimizationIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2024.339393014:6(993-1006)Online publication date: Jun-2024

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cover image ACM Conferences
DAC '22: Proceedings of the 59th ACM/IEEE Design Automation Conference
July 2022
1462 pages
ISBN:9781450391429
DOI:10.1145/3489517
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 23 August 2022

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Cited By

View all
  • (2024)SLDPSO-TA: Track Assignment Algorithm Based on Social Learning Discrete Particle Swarm OptimizationElectronics10.3390/electronics1322457113:22(4571)Online publication date: 20-Nov-2024
  • (2024)Physical Design Challenges in Modern Heterogeneous IntegrationProceedings of the 2024 International Symposium on Physical Design10.1145/3626184.3639690(125-134)Online publication date: 12-Mar-2024
  • (2024)Layer and Length-Deviation Limit Aware Interposer Routing for Bend and Wirelength MinimizationIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2024.339393014:6(993-1006)Online publication date: Jun-2024

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