skip to main content
10.1145/3508297.3508376acmotherconferencesArticle/Chapter ViewAbstractPublication PageseeetConference Proceedingsconference-collections
research-article

Copper Oxide Formations under Polymer Coatings during Accelerated Thermal Aging

Authors Info & Claims
Published:21 April 2022Publication History

ABSTRACT

Enameled wires are used in solenoids, electrical actuators, and rotor and stator windings in electric machines. These wires typically comprise copper conductors, which are preferred for their balance between cost and current carrying capacity, combined with a dielectric insulating layer. This insulation is made from polymeric materials, which can provide high dielectric strength with a relatively thin coating layer. The downside of these polymers is their inherent oxygen permeability, which may have an effect on the degradation phenomena associated with the conductor material. The main focus is typically on either the conductor or the insulator, but it does not consider collective antagonistic/synergistic interactions. The results presented in this paper outline a preliminary analysis of the interaction between the conductor and the insulation layer(s), focusing primarily on the interfacial region. Thermal degradation at the copper conductor/enamel insulation interface at 250ºC for five aging time periods (100 to 500 hours) is reported. The oxidation processes of copper were studied using X-ray Photo-Electron Spectroscopy. The impact of exposure time on the type and amount of each oxide was analyzed and was related to the identified degradation phenomena.

References

  1. J. H. Thomas, J. F. Dexter,"Transactions of the American Institute of Electrical Engineers. Part III: Power Apparatus and Systems," Effect of Wire Metal on the Thermal Life of Enamelled Magnet Wire, 76 (3), 1009–13, (1957).Google ScholarGoogle Scholar
  2. B. Petitgas, G. Seytre, O. Gain, G. Boiteux, I. Royaud, A. Serghei, A. Gimenez, A. Anton,“ 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena," High Temperature Aging of Enameled Copper Wire- Relationships between Chemical Structure and Electrical Behavior,” 84–88, (2011).Google ScholarGoogle Scholar
  3. P. Werynski, D. Roger, R. Corton, J. F. Brudny, "IEEE Trans. Energy Conversion," Proposition of a new method for in-service monitoring of the aging of stator winding insulation in AC motors, 21 (3), 673–681, (2006).Google ScholarGoogle Scholar
  4. J. Kurek, R. Bernstein, M. Etheridge, G. LaSalle, R. McMahon, J. Meiner, N. Turner,M. Walz, C. Gomez, "US Department of Transportation, Federal Aviation Administration, " Aircraft wiring degradation study. ( 2008).Google ScholarGoogle Scholar
  5. E. L. Brancato, "IEEE Transactions on Electrical Insulation," Insulation Aging a Historical and Critical Review, EI-13(4), 308–17, (1978).Google ScholarGoogle Scholar
  6. L. L. Korcak, D. F. Kavanagh,"International Conference on Diagnostics in Electrical Engineering (Diagnostika)," Thermal Accelerated Aging Methods for Magnet Wire: A Review, 1–4, (2018)Google ScholarGoogle Scholar
  7. C. Araki, T. Taguchi,"Proceedings of IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 93)," Thermal degradation of polyesterimide magnet wire, 526–531, (1993).Google ScholarGoogle Scholar
  8. S. K. Lee, H. C. Hsu, W. H. Tuan,"Materials Research", Oxidation Behavior of Copper at a Temperature below 300 °C and the Methodology for Passivation, 19(1), 51–56, (2016).Google ScholarGoogle Scholar
  9. R. Beeckman, NEMA Magnet Wire Thermal Class Ratings superioressex,https://www.superioressex.com/uploadedFiles/News/White_Papers/emcwa-nema_magnet-thermal-class-ratings.pdf, (Accessed: 07/03/2018).Google ScholarGoogle Scholar
  10. W. Zhao, J. Wu, A. Hu, M. Li, D. Mao, "2010 11th International Conference on Electronic Packaging Technology High Density Packaging," An investigation into copper oxidation behavior, 319–323, (2010).Google ScholarGoogle Scholar
  11. G. Fritz-Popovski, F. Sosada-Ludwikowska, A. Köck, J. Keckes, G. A. Maier,"Sci Rep," Study of CuO Nanowire Growth on Different Copper Surfaces, 9(1), 1–13, (2019).Google ScholarGoogle Scholar
  12. C. M. Whelan, M. Kinsella, H. M. Ho, K. Maex, "Journal of Electronic Materials", In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding, 33(9), 1005–1011, (2004).Google ScholarGoogle Scholar
  13. G. G. Jernigan, G. A. Somorjai, "Journal of Catalysis," Carbon Monoxide Oxidation over Three Different Oxidation States of Copper: Metallic Copper, Copper (I) Oxide, and Copper (II) Oxide - A Surface Science and Kinetic Study, 147(2), 567–577, (1994).Google ScholarGoogle Scholar
  14. K. Mimura, J. W. Lim, M. Isshiki, Y. Zhu, Q. Jiang, "Metallurgical and Materials Transactions A," Brief review of oxidation kinetics of copper at 350 °C to 1050 °C, 37(4), 1231–1237, (2006).Google ScholarGoogle Scholar
  15. G.C. Stone, E.A. Boulter, I. Culbert, H. Dhirani, Electrical insulation for rotating machines, design, evaluation, aging, testing and repair, (2004).Google ScholarGoogle Scholar
  16. L. L. Korcak, D. Culliton, K. Ryder, S. Roy, Aluminium Clad Copper with DES, DOI:10.13140/RG.2.2.33190.88644, (2019).Google ScholarGoogle Scholar

Recommendations

Comments

Login options

Check if you have access through your login credentials or your institution to get full access on this article.

Sign in
  • Published in

    cover image ACM Other conferences
    EEET 2021: 2021 4th International Conference on Electronics and Electrical Engineering Technology
    December 2021
    290 pages
    ISBN:9781450385169
    DOI:10.1145/3508297

    Copyright © 2021 ACM

    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

    Publisher

    Association for Computing Machinery

    New York, NY, United States

    Publication History

    • Published: 21 April 2022

    Permissions

    Request permissions about this article.

    Request Permissions

    Check for updates

    Qualifiers

    • research-article
    • Research
    • Refereed limited
  • Article Metrics

    • Downloads (Last 12 months)15
    • Downloads (Last 6 weeks)6

    Other Metrics

PDF Format

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

HTML Format

View this article in HTML Format .

View HTML Format