research-article

Routability-Driven Analytical Placement with Precise Penalty Models for Large-Scale 3D ICs

Authors:

Hao-Yuan Hsieh,

Hao-Jia LinAuthors Info & Claims

ICCAD '22: Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design

Article No.: 119, Pages 1 - 8

https://doi.org/10.1145/3508352.3549339

Published: 22 December 2022 Publication History

Abstract

Quality of a true 3D placement approach greatly relies on the correctness of the models used in its formulation. However, the models used by previous approaches are not precise enough. Moreover, they do not actually place TSVs which makes their approach unable to get accurate wirelength and construct a correct congestion map. Besides, they rarely discuss routability which is the most important issue considered in 2D placement. To resolve this insufficiency, this paper proposes more accurate models to estimate placement utilization and TSV number by the softmax function which can align cells to exact tiers. Moreover, we propose a fast parallel algorithm to update the locations of TSVs when cells are moved during optimization. Finally, we present a novel penalty model to estimate routing overflow of regions covered by cells and inflate cells in congested regions according to this model. Experimental results show that our methodology can obtain better results than previous works.

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Cited By

Lin JLin YKung HLin W(2023)HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323786(1-8)Online publication date: 28-Oct-2023
https://doi.org/10.1109/ICCAD57390.2023.10323786

Index Terms

Routability-Driven Analytical Placement with Precise Penalty Models for Large-Scale 3D ICs
1. Hardware
  1. Electronic design automation
    1. Physical design (EDA)
      1. Placement

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cover image ACM Conferences

ICCAD '22: Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design

October 2022

1467 pages

ISBN:9781450392174

DOI:10.1145/3508352

Conference Chair:
Tulika Mitra
National University of Singapore
,
Program Chairs:
Evangeline Young
The Chinese University of Hong Kong
,
Jinjun Xiong
University at Buffalo (UB)

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New York, NY, United States

Publication History

Published: 22 December 2022

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ICCAD '22: IEEE/ACM International Conference on Computer-Aided Design

October 30 - November 3, 2022

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Cited By

Lin JLin YKung HLin W(2023)HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323786(1-8)Online publication date: 28-Oct-2023
https://doi.org/10.1109/ICCAD57390.2023.10323786

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