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Obstacle-Avoiding Multiple Redistribution Layer Routing with Irregular Structures

Published: 22 December 2022 Publication History

Abstract

In advanced packages, redistribution layers (RDLs) are extra metal layers for high interconnections among the chips and printed circuit board (PCB). To better utilize the routing resources of RDLs, published works adopted flexible vias such that they can place the vias everywhere. Furthermore, some regions may be blocked for signal integrity protection or manually prerouted nets (such as power/ground nets or feeding lines of antennas) to achieve higher performance. These blocked regions will be treated as obstacles in the routing process. Since the positions of pads, obstacles, and vias can be arbitrary, the structures of RDLs become irregular. The obstacles and irregular structures substantially increase the difficulty of the routing process. This paper proposes a three-stage algorithm: First, the layout is partitioned by a method based on constrained Delaunay triangulation (CDT). Then we present a global routing graph model and generate routing guides for unified-assignment netlists. Finally, a novel tile routing method is developed to obtain detailed routes. Experiment results demonstrate the robustness and effectiveness of our proposed algorithm.

References

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  • (2024)Physical Design Challenges in Modern Heterogeneous IntegrationProceedings of the 2024 International Symposium on Physical Design10.1145/3626184.3639690(125-134)Online publication date: 12-Mar-2024

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cover image ACM Conferences
ICCAD '22: Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design
October 2022
1467 pages
ISBN:9781450392174
DOI:10.1145/3508352
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 22 December 2022

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ICCAD '22
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ICCAD '22: IEEE/ACM International Conference on Computer-Aided Design
October 30 - November 3, 2022
California, San Diego

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  • (2024)Physical Design Challenges in Modern Heterogeneous IntegrationProceedings of the 2024 International Symposium on Physical Design10.1145/3626184.3639690(125-134)Online publication date: 12-Mar-2024

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