Tomohito Suzuki
ABSTRACT
Several electric circuit prototyping techniques have been proposed. While most focus on creating the conductive traces, we focus on the bonding technique needed for this kind of circuit. Our technique is an extension of existing work in that we use the traces themselves as the bonding material for the components. The bonding process is not soldering but yields joints of adequate connectivity. A hot soldering iron is used to activate the traces and bond the component to the circuit. Simple circuits are created on MDF, paper, and acrylic board to show the feasibility of the technique. It is also confirmed that the resistance of the contact points is sufficiently low.
- Youngkyung Choi, Neung Ryu, Myung Jin Kim, Artem Dementyev, and Andrea Bianchi. 2020. BodyPrinter: Fabricating Circuits Directly on the Skin at Arbitrary Locations Using a Wearable Compact Plotter. In Proceedings of the 33rd Annual ACM Symposium on User Interface Software and Technology (Virtual Event, USA) (UIST ’20). Association for Computing Machinery, New York, NY, USA, 554–564. https://doi.org/10.1145/3379337.3415840Google Scholar
Digital Library
- Freddie Hong, Connor Myant, and David E Boyle. 2021. Thermoformed Circuit Boards: Fabrication of Highly Conductive Freeform 3D Printed Circuit Boards with Heat Bending. In Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems. Association for Computing Machinery, New York, NY, USA, Article 669, 10 pages. https://doi.org/10.1145/3411764.3445469Google ScholarDigital Library
- Yuhei Imai and Hiroyuki Manabe. 2021. Single-Sided Multi-Layer Electric Circuit by Hot Stamping with 3D Printer. In The Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology (Virtual Event, USA) (UIST ’21). Association for Computing Machinery, New York, NY, USA, 126–128. https://doi.org/10.1145/3474349.3480200Google ScholarDigital Library
- Yoshihiro Kawahara, Steve Hodges, Benjamin S. Cook, Cheng Zhang, and Gregory D. Abowd. 2013. Instant Inkjet Circuits: Lab-Based Inkjet Printing to Support Rapid Prototyping of UbiComp Devices. In Proceedings of the 2013 ACM International Joint Conference on Pervasive and Ubiquitous Computing (Zurich, Switzerland) (UbiComp ’13). Association for Computing Machinery, New York, NY, USA, 363–372. https://doi.org/10.1145/2493432.2493486Google ScholarDigital Library
- Nobuyuki Umetani and Ryan Schmidt. 2017. SurfCuit: Surface-Mounted Circuits on 3D Prints. IEEE Computer Graphics and Applications 37, 3 (2017), 52–60. https://doi.org/10.1109/MCG.2017.40Google ScholarDigital Library
Index Terms
- A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron
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