A Multilevel Spectral Framework for Scalable Vectorless Power/Thermal Integrity Verification
Authors: 
Zhiqiang Zhao, Zhuo FengAuthors Info & Claims
Zhiqiang Zhao, Zhuo FengAuthors Info & ClaimsArticle No.: 11, Pages 1 - 25
Abstract
Vectorless integrity verification is becoming increasingly critical to the robust design of nanoscale integrated circuits. This article introduces a general vectorless integrity verification framework that allows computing the worst-case voltage drops or temperature (gradient) distributions across the entire chip under a set of local and global workload (power density) constraints. To address the computational challenges introduced by the large power grids and three-dimensional mesh-structured thermal grids, we propose a novel spectral approach for highly scalable vectorless verification of large chip designs by leveraging a hierarchy of almost linear-sized spectral sparsifiers of input grids that can well retain effective resistances between nodes. As a result, the vectorless integrity verification solution obtained on coarse-level problems can effectively help compute the solution of the original problem. Our approach is based on emerging spectral graph theory and graph signal processing techniques, which consists of a graph topology sparsification and graph coarsening phase, an edge weight scaling phase, as well as a solution refinement procedure. Extensive experimental results show that the proposed vectorless verification framework can efficiently and accurately obtain worst-case scenarios in even very large designs.
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Index Terms
- A Multilevel Spectral Framework for Scalable Vectorless Power/Thermal Integrity Verification
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January 2023
321 pages
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Publication History
Published: 10 December 2022
Online AM: 15 June 2022
Accepted: 29 March 2022
Revised: 03 March 2022
Received: 03 December 2021
Published in TODAES Volume 28, Issue 1
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