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A Non-Associated MSCC Model for Simulating Structured and Destructured Clays

Published: 13 December 2022 Publication History

Abstract

Soil structure describes the association and arrangement of the soil granules. Structured clays, such as the cracked dry ground, exhibit characteristics of solid-like materials, while destructured clays exhibit characteristics of granular materials. The structure strength weakens with the deviatoric plastic strain accumulation, which leads to clay degradation. However, the existing graphics methods for granular materials cannot simulate this unique mechanical behavior. We present a non-associated Modified Structured Cam Clay (MSCC) model for simulating structured and destructured clays. We track the deviatoric part of the plastic Hencky strain and design two degradation functions (corresponding to yield stress and mean effective stress) to control the size of the yield surface. Through a non-associated flow rule, our method generates visually plausible results while allowing volume preservation.

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References

[1]
J. Gaume, T. Gast, J. Teran, A. van Herwijnen, and C. Jiang. 2018. Dynamic anticrack propagation in snow. Nature Communications 9, 1 (03 Aug 2018), 3047. https://doi.org/10.1038/s41467-018-05181-w
[2]
Gergely Klár, Theodore Gast, Andre Pradhana, Chuyuan Fu, Craig Schroeder, Chenfanfu Jiang, and Joseph Teran. 2016. Drucker-Prager Elastoplasticity for Sand Animation. ACM Trans. Graph. 35, 4, Article 103 (jul 2016), 12 pages. https://doi.org/10.1145/2897824.2925906
[3]
Jirayut Suebsuk, Suksun Horpibulsuk, and Martin D. Liu. 2010. Modified Structured Cam Clay: A generalised critical state model for destructured, naturally structured and artificially structured clays. Computers and Geotechnics 37, 7 (2010), 956–968. https://doi.org/10.1016/j.compgeo.2010.08.002
[4]
Joshuah Wolper, Yu Fang, Minchen Li, Jiecong Lu, Ming Gao, and Chenfanfu Jiang. 2019. CD-MPM: Continuum Damage Material Point Methods for Dynamic Fracture Animation. ACM Trans. Graph. 38, 4, Article 119 (jul 2019), 15 pages. https://doi.org/10.1145/3306346.3322949

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Published In

cover image ACM Conferences
SA '22: SIGGRAPH Asia 2022 Posters
December 2022
120 pages
ISBN:9781450394628
DOI:10.1145/3550082
  • Editors:
  • Soon Ki Jung,
  • Neil Dodgson
Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 13 December 2022

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SA '22
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SA '22: SIGGRAPH Asia 2022
December 6 - 9, 2022
Daegu, Republic of Korea

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Overall Acceptance Rate 178 of 869 submissions, 20%

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