Cited By
View all- Lee YChiou HJiang J(undefined)Thermal-Aware Chiplet Placement for 2.5D ICs with Sequence Pair Based TreeACM Transactions on Design Automation of Electronic Systems10.1145/3716893
This work develops an efficient thermal-aware chiplet placer with sequence-pair representation. It provides wirelength-driven placement and thermal-aware placement. Its wirelength-driven option combines the sequence-pair based tree, a parallel branch-and-...
The rapid increase in IC design complexity and wide-spread use of intellectual-property (IP) blocks have made the so-called mixed-size placement a very important topic in recent years. Although several algorithms have been proposed for mixed-sized ...
Through-silicon vias (TSVs) are required for transmitting signals among different dies for the three-dimensional integrated circuit (3D IC) technology. The significant silicon areas occupied by TSVs bring critical challenges for 3D IC placement. Unlike ...
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