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A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis

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Published:17 May 2023Publication History
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Abstract

The electromigration-induced reliability issues (EM) in very large scale integration (VLSI) circuits have attracted continuous attention due to technology scaling. Traditional EM methods lead to inaccurate results incompatible with the advanced technology nodes. In this article, we propose a learning-based model by enforcing physical constraints of EM kinetics to solve the EM reliability problem. The method aims at solving stress-based partial differential equations (PDEs) to obtain the hydrostatic stress evolution on interconnect trees during the void nucleation phase, considering varying atom diffusivity on each segment, which is one of the EM random characteristics. The approach proposes a crafted neural network-based framework customized for the EM phenomenon and provides mesh-free solutions benefiting from the employment of automatic differentiation (AD). Experimental results obtained by the proposed model are compared with solutions obtained by competing methods, showing satisfactory accuracy and computational savings.

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    • Published in

      cover image ACM Transactions on Design Automation of Electronic Systems
      ACM Transactions on Design Automation of Electronic Systems  Volume 28, Issue 4
      July 2023
      432 pages
      ISSN:1084-4309
      EISSN:1557-7309
      DOI:10.1145/3597460
      Issue’s Table of Contents

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      Publication History

      • Published: 17 May 2023
      • Online AM: 10 October 2022
      • Accepted: 23 September 2022
      • Revised: 15 September 2022
      • Received: 14 April 2022
      Published in todaes Volume 28, Issue 4

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