research-article

A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis

Authors:

Hai-Bao ChenAuthors Info & Claims

ACM Transactions on Design Automation of Electronic Systems, Volume 28, Issue 4

Article No.: 57, Pages 1 - 20

https://doi.org/10.1145/3567424

Published: 17 May 2023 Publication History

Abstract

The electromigration-induced reliability issues (EM) in very large scale integration (VLSI) circuits have attracted continuous attention due to technology scaling. Traditional EM methods lead to inaccurate results incompatible with the advanced technology nodes. In this article, we propose a learning-based model by enforcing physical constraints of EM kinetics to solve the EM reliability problem. The method aims at solving stress-based partial differential equations (PDEs) to obtain the hydrostatic stress evolution on interconnect trees during the void nucleation phase, considering varying atom diffusivity on each segment, which is one of the EM random characteristics. The approach proposes a crafted neural network-based framework customized for the EM phenomenon and provides mesh-free solutions benefiting from the employment of automatic differentiation (AD). Experimental results obtained by the proposed model are compared with solutions obtained by competing methods, showing satisfactory accuracy and computational savings.

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Cited By

Wu XChen MKe L(2025)An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnectsInternational Journal of Mechanical Sciences10.1016/j.ijmecsci.2024.109792285(109792)Online publication date: Jan-2025
https://doi.org/10.1016/j.ijmecsci.2024.109792
Ye RChen X(2024)Electromigration Analysis for Interconnects Using Improved Graph Convolutional Network with Edge Feature AggregationMicromachines10.3390/mi1508104615:8(1046)Online publication date: 18-Aug-2024
https://doi.org/10.3390/mi15081046
Yang XChen HZhang YHou TRen PWang RJi ZHuang R(2024)Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration AnalysisACM Transactions on Design Automation of Electronic Systems10.1145/370610630:2(1-22)Online publication date: 29-Nov-2024
https://dl.acm.org/doi/10.1145/3706106

Index Terms

A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis
1. Hardware
  1. Electronic design automation

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Published In

cover image ACM Transactions on Design Automation of Electronic Systems

ACM Transactions on Design Automation of Electronic Systems Volume 28, Issue 4

July 2023

432 pages

ISSN:1084-4309

EISSN:1557-7309

DOI:10.1145/3597460

Editor:
X. Sharon Hu
University of Notre Dame, USA

Issue’s Table of Contents

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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Association for Computing Machinery

New York, NY, United States

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 17 May 2023

Online AM: 10 October 2022

Accepted: 23 September 2022

Revised: 15 September 2022

Received: 14 April 2022

Published in TODAES Volume 28, Issue 4

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Cited By

Wu XChen MKe L(2025)An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnectsInternational Journal of Mechanical Sciences10.1016/j.ijmecsci.2024.109792285(109792)Online publication date: Jan-2025
https://doi.org/10.1016/j.ijmecsci.2024.109792
Ye RChen X(2024)Electromigration Analysis for Interconnects Using Improved Graph Convolutional Network with Edge Feature AggregationMicromachines10.3390/mi1508104615:8(1046)Online publication date: 18-Aug-2024
https://doi.org/10.3390/mi15081046
Yang XChen HZhang YHou TRen PWang RJi ZHuang R(2024)Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration AnalysisACM Transactions on Design Automation of Electronic Systems10.1145/370610630:2(1-22)Online publication date: 29-Nov-2024
https://dl.acm.org/doi/10.1145/3706106

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