- Sponsor:
- sigda
On behalf of the organizing committee, we are delighted to welcome you to the 33rd ACM International Symposium on Physical Design (ISPD). After the COVID-19 pandemic, we return to a fully in-person ISPD, held in Taipei, Taiwan for the first time. We continue the great tradition established by its thirtytwo predecessors, providing a premier forum to exchange ideas, highlight key technology challenges, present leading-edge theoretical and experimental contributions, and identify future research directions in this field. We extend the good practice, adopted during the pandemic, of having a YouTube channel to view the talks during the symposium and afterwards, improving access to the presentations.
Across three days, ISPD 2024 has 3 keynotes, 18 accepted papers, 16 invited talks; one panel on Wednesday with 6 panelists; and 4 speakers with longer talks in Professor Martin D. F. Wong's commemorative session, and finally the ISPD 2024 contest results. ISPD 2024 is co-located with the 25th Workshop on Synthesis and System Integration of Mixed Information technologies (SASIMI).
This year, we received a total of 62 abstracts and we received 48 full manuscripts, from which 18 were selected - a 37.5% acceptance rate. The regular papers in the ISPD 2024 program were selected, after a rigorous month-long double-blind review process and virtual meetings, by the Technical Program Committee with 20 outstanding international professionals from both academia and industry. These papers exhibit the latest advancements in a variety of topics in physical design, including partitioning and clustering; mixed cell-height placement and legalization; macro placement; global placement; standard cell design automation; timing and power optimization; reliability (IR drop); quantum circuits and quantum computing systems; and mask optimization in lithography. A number of these papers utilize advanced mathematical programming, satisfiability problem solving, GPU acceleration, and machine learning techniques.
Index Terms
- Proceedings of the 2024 International Symposium on Physical Design