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Solving the Physical Challenges for the Next Generation of Safety Critical & High Reliability Systems

Published:12 March 2024Publication History

ABSTRACT

Silicon systems have been part of automobiles for a long time. The physical design methodology to address the quality, reliability, and safety challenges of these systems are common knowledge in the leading automotive semiconductor companies. The rise of trends like autonomous driving (ADAS), software defined vehicles (SDV) and the electrification of our transportation network are giving rise to not only new levels of these challenges, but also many new players in the automotive semiconductor space. The same forces of opportunity which are transforming our society are also the foundation of a transformation in automotive semiconductor design: massive improvements in accelerated compute, 3DIC and chiplet based design, digital twins, and artificial intelligence (AI). We'll discuss how these forces are helping modern automotive semiconductor design and highlight how the electronic design automation (EDA) industry can apply successful principles from earlier eras to these new challenges.

References

  1. "Challenges and Opportunities in Automotive, Industrial, and IOT Physical Design" AM Hill, http://www.ispd.cc/slides/2018/kpdfGoogle ScholarGoogle Scholar

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  1. Solving the Physical Challenges for the Next Generation of Safety Critical & High Reliability Systems

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      • Published in

        cover image ACM Conferences
        ISPD '24: Proceedings of the 2024 International Symposium on Physical Design
        March 2024
        286 pages
        ISBN:9798400704178
        DOI:10.1145/3626184

        Copyright © 2024 Owner/Author

        Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

        Publisher

        Association for Computing Machinery

        New York, NY, United States

        Publication History

        • Published: 12 March 2024

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        Overall Acceptance Rate62of172submissions,36%
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