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Chip Surface Defect Detection Algorithm Based on Improved YOLOv3

Published: 22 May 2024 Publication History

Abstract

Chip package testing is a key process to eliminate bad products in the electronics industry. Aiming at the problems of YOLOv3 chip detection in complex environments with low accuracy and large number of model parameters, an improved YOLOv3 automatic detection method based on EMO, called EMO-YOLOV3, was proposed. This method uses EMO to replace the backbone of Darknet53 in YOLOv3, inherits the efficiency of CNN to model short-range dependencies and the dynamic modeling capability of Transformer to learn long-distance interactions. The results show that the model has a very good detection effect on 7 kinds of environment, such as character defect, scratch defect and braid damage. Compared with the original YOLOv3 model, the mAP of chip surface defect detection is improved by about 3.4% while the number of model parameters is reduced. Therefore, it is considered that this method can be used for real-time automatic detection of chip surface defects.

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  1. Chip Surface Defect Detection Algorithm Based on Improved YOLOv3

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    VSIP '23: Proceedings of the 2023 5th International Conference on Video, Signal and Image Processing
    November 2023
    237 pages
    ISBN:9798400709272
    DOI:10.1145/3638682
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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    Published: 22 May 2024

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    Author Tags

    1. Embedded
    2. lightweight network
    3. target detection

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