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Strained-si devices and circuits for low-power applications

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Published:25 August 2003Publication History

ABSTRACT

Static and dynamic power for strained-Si device is analyzed and compared with conventional bulk-Si technology. Optimum device design points are suggested with controlling physical/structural device parameters. Strained-Si CMOS circuits are studied, showing substantially-reduced power consumptions due to unique advantageous features of strained-Si device. The trade-offs for power and performance in strained-Si devices/circuits are discussed. Further, analysis and low-power design points are applied and extended to strained Si on SOI substrate (SSOI) CMOS technology.

References

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  1. Strained-si devices and circuits for low-power applications

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      • Published in

        cover image ACM Conferences
        ISLPED '03: Proceedings of the 2003 international symposium on Low power electronics and design
        August 2003
        502 pages
        ISBN:158113682X
        DOI:10.1145/871506

        Copyright © 2003 ACM

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        Association for Computing Machinery

        New York, NY, United States

        Publication History

        • Published: 25 August 2003

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        ISLPED '03 Paper Acceptance Rate90of221submissions,41%Overall Acceptance Rate398of1,159submissions,34%

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